iPhone Board Separation
iPhone Board Separation

If you are dealing with electronics or printed circuit boards (PCBs), you may come across the term ‘board separation.’ But what exactly does this mean? In this article, we’ll dive deep into the meaning of board separation, its causes, impacts, and how to prevent it.

Understanding Board Separation

Definition of Board Separation

In the simplest terms, board separation refers to a condition where the layers of a multilayer printed circuit board (PCB) begin to separate or delaminate. It often leads to the failure of the PCB, disrupting the device’s operation where it is used.

Causes of Board Separation

Board separation or delamination can be caused by various factors. One of the most common causes is exposure to excessive heat during the soldering process. Inadequate prepreg (pre-impregnated composite fibers) bonding during the PCB manufacturing process can also lead to separation. Other factors include mechanical stress, moisture, and thermal shock.

The Impact of Board Separation

Board separation can lead to various problems, such as electrical failure due to broken circuits, reduced structural integrity of the PCB, and even complete device failure. It can significantly impact the reliability and lifespan of the electronic device in which the PCB is installed.

Solutions and Prevention

Proper Handling and Storage

To prevent board separation, it is essential to handle and store PCBs correctly. This includes protecting them from excessive heat and humidity, and ensuring that they are not subjected to physical stress.

Use of Suitable Materials

Selecting high-quality materials for PCB manufacturing is another preventive measure. Using quality prepregs and ensuring proper bonding during the manufacturing process can help avoid delamination.

Regular Maintenance and Inspection

Regular inspections and maintenance of PCBs can help detect early signs of board separation and take appropriate measures. This includes looking for visible signs of delamination, such as bubbles or blisters on the PCB surface.


Board separation is a common but preventable problem in PCBs. By understanding what it is, its causes, and its impacts, we can take appropriate measures to prevent it and ensure the longevity and reliability of our electronic devices.


  1. What is board separation? Board separation refers to the delamination or separation of the layers in a multilayer printed circuit board (PCB).
  2. What causes board separation? Excessive heat during soldering, inadequate prepreg bonding during manufacturing, mechanical stress, moisture, and thermal shock can cause board separation.
  3. What are the impacts of board separation? It can lead to electrical failure, reduced structural integrity of the PCB, and even complete device failure.
  4. How can I prevent board separation? Proper handling and storage of PCBs, using high-quality materials in manufacturing, and regular maintenance and inspection can prevent board separation.
  5. What are the signs of board separation? Visible signs can include bubbles or blisters on the PCB surface, indicating potential delamination.
Eric Chan

Hi! I’m Eric and I work on the knowledge base at GadgetMates.com.  You can see some of my writings about technology, cellphone repair, and computer repair here.

When I’m not writing about tech I’m playing with my dog or hanging out with my girlfriend.

Shoot me a message at ericchan@gadgetmates.com if you want to see a topic discussed or have a correction on something I’ve written.

Similar Posts

Leave a Reply

Your email address will not be published. Required fields are marked *