In the dynamic world of technology, the demand for high-speed, high-performance components continues to escalate. Whether it’s graphics processing or machine learning, faster memory is essential. That’s where High Bandwidth Memory (HBM) makes its grand entrance. But what is HBM, and why is it shaking up the tech scene? Let’s delve into the world of HBM.

Understanding Memory Bandwidth

Before we leap into HBM, it’s vital to grasp what memory bandwidth is. Simply put, it’s the rate at which data can be read from or stored into a semiconductor memory by a processor. As applications become more complex, the need for higher bandwidth grows.

What is HBM?

HBM stands for High Bandwidth Memory. It’s a type of memory chip that offers far higher bandwidth than traditional DDR (Double Data Rate) memory modules. HBM achieves this by stacking memory chips vertically, resulting in reduced space, higher speeds, and increased efficiency.

HBM vs. Traditional DDR Memory

Architecture Difference

Traditional DDR memory lies flat on the motherboard. In contrast, HBM is 3D-stacked, allowing for multiple layers of DRAM cells to be stacked atop one another.

Power Efficiency

HBM consumes significantly less power compared to DDR memory, making it a preferred choice for applications where power efficiency is paramount.


Due to its high-speed interface, HBM can achieve speeds that outpace DDR memory, especially in applications that require massive parallel processing.

Applications of HBM

Graphics Cards

Many high-end graphics cards now utilize HBM because of its ability to handle high-resolution games and graphics-intensive applications.

High-Performance Computing

Supercomputers and advanced computing systems that manage complex simulations often rely on HBM for its speed and efficiency.

Machine Learning and AI

Training machine learning models requires intense computational power and memory. HBM meets these needs, making it a favorite in the AI realm.

HBM3 in High-Performance-Computing & AI Applications

The explosion of AI and machine learning (AI/ML) applications has been nothing short of spectacular. From 2012 to now, we’ve seen an astounding 300,000-fold increase in AI training capabilities. Consequently, this has placed immense strain on memory bandwidth and capacity, spotlighting them as potential performance barriers. As the technological demands surge, data centers yearn for superior bandwidth and enhanced efficiency.

The Rise of Tailored Memory Technologies: Welcome HBM

High Bandwidth Memory (HBM) is becoming a game-changer in this context. Following JEDEC’s announcement of the HBM3 standard this January, anticipation has built around its potential to uplift AI/ML performance in data centers. Like its forerunners, HBM2 and HBM2E, the HBM3 standard also employs a 3D-stacked memory layout. This innovative design ensures impressive bandwidth, heightened capacity, and a compact size.

While HBM3 has emerged as the latest buzzword, its widespread deployment will be a gradual process. HBM, despite its advantages over 2D memories like DDR and GDDR, requires intricate implementation. Yet, the perks, including performance efficiencies and reduced footprint, are too substantial to ignore.

HBM3 vs. HBM2E: The Battle of the Bandwidths

The leap from HBM2E to HBM3 is marked by pronounced enhancements. HBM3 boasts data rates of 6.4 Gb/s per pin, potentially reaching a remarkable 820 GB/s of bandwidth with a lone HBM3 stack. In contrast, HBM2E’s bandwidth peaked at 461 GB/s.

Additionally, HBM3 promises amplified DRAM chip capacity, augmented 3D stack height, and a faster data rate. In practical terms, using four HBM3 DRAM stacks can yield an astounding 3.2 TB/s of bandwidth.

Power efficiency also sets the two apart. HBM3 introduces a reduced IO voltage of 0.4-V (LVSTL IO) compared to the 1.2 V of HBM2E and HBM2. This ensures better power management, especially at increased speeds. Yet, this advantage doesn’t come without challenges; reduced voltage might impact design margins, amplifying SI design intricacies.

Moreover, while HBM3 brings forth several upgrades, both HBM3 and HBM2E maintain comparable reliability, availability, and serviceability (RAS). Despite higher operating speeds and potential inefficiencies, HBM3 sustains its RAS levels.

Given the perpetual quest for superior bandwidth, HBM3 is poised to dominate HPC and AI/ML applications. With its unmatched bandwidth and capacity advantages, HBM3 stands tall as the newest industry favorite.

Micron Steps into the Future with HBM3 Gen2 Memory

Micron’s announcement of their inaugural HBM3 offerings is a milestone. Venturing into the ultra-fast memory realm, Micron plans to transition directly to advanced versions called “HBM3 Gen2”, aiming for 24 GB stacks operating over 9 GigaTransfers-per-second. Primarily catering to AI and HPC data centers, Micron sets its eyes on launching these in early 2024.

Unique in its approach, Micron’s 24 GB HBM3 Gen2 modules use eight 24Gbit memory dies crafted with their 1β fabrication process. The firm intends to outshine competitors with 24 GB HBM3 modules in a standard 8-Hi configuration. But Micron’s aspirations don’t end here; next year, they plan to roll out a leading 36 GB 12-Hi HBM3 Gen2 stack.

Beyond density, speed is Micron’s next frontier. Their HBM3 Gen2 targets date rates of a blistering 9.2 GT/second. This performance is 44% faster than the primary HBM3 specification and even surpasses the 8 GT/second of SK hynix’s HBM3E memory. Such swift data transfer rates empower the 24 GB memory modules to reach a peak bandwidth of an awe-inspiring 1.2 TB/sec per stack.

Micron HBM3 Gen2 Memory: A Game-Changer for AI and Supercomputing

Micron’s newly introduced HBM3 Gen2 (HBM3E) memory promises groundbreaking advancements in AI, high-performance computing, and supercomputing. Here’s a breakdown of what makes it a standout:

1. Superior Performance:

  • Micron claims its HBM3 Gen2 memory can achieve a bandwidth of 4.8 TB/s for 4096-bit HBM3 subsystems and 7.2 TB/s for 6096-bit HBM3 subsystems. For context, Nvidia’s H100 SXM currently peaks at 3.35 TB/s.
  • The bandwidth per stack is 1.2 TB/s, a significant jump from its predecessors.

2. Technical Advancements:

  • Micron increased the number of through-silicon vias (TSVs) by 2x, enhancing bandwidth, power efficiency, and reliability.
  • They’ve also shrunk the distance between DRAM devices, helping in better cooling of the modules.

3. AI and Generative Innovation:

  • HBM3 Gen2 facilitates generative AI, unlocking new creative possibilities. The memory capacity plays a pivotal role in the training and inference time of large language models, such as ChatGPT™.
  • It addresses the requirements of advanced AI models, ensuring efficient compute and memory interaction, vital for performance, cost, and power management.

4. A Boost for High-Performance Computing (HPC):

  • HPC drives innovation in fields like climate modeling and medicine. Micron’s HBM3 Gen2 offers higher memory capacity, streamlining data distribution and propelling research.

5. Industry-Leading Features:

  • The memory offers more than 1.2TB/s memory bandwidth and a 50% capacity increase from the previous generation.
  • The HBM3 Gen2 provides over 2.5x performance improvement per watt, beneficial for AI and HPC workloads. Plus, it enables faster training times and allows for a significant increase in AI model queries per day.


High Bandwidth Memory (HBM) has transformed the way we think about memory in high-performance applications. With its innovative architecture, power efficiency, and unmatched speed, it’s set to be the cornerstone of future tech innovations. As we continue to push the boundaries of what’s possible, HBM stands as a testament to human ingenuity in the world of tech.

With advancements in technology, HBM continues to evolve. HBM2 and HBM3, successors of the original HBM, offer even greater speeds and efficiency. As applications become more demanding, the role of HBM in shaping the future tech landscape is undeniable.

HBM3 Gen2 is positioning itself as a foundational element in driving unprecedented computational possibilities. Its advancements in performance, coupled with technical innovations, make it primed to push the boundaries of AI and supercomputing.

And they aren’t stopping there. The next iteration of HBM potentially will offer 1.5 TB/s to 2+ TB/s bandwidth per stack with capacities ranging between 36 GB to 64 GB.


  1. How does HBM achieve higher bandwidth?
    • HBM utilizes a wider interface with a 3D-stacked architecture, allowing for more data paths and higher speeds.
  2. Is HBM more expensive than DDR memory?
    • Generally, yes. HBM is costlier due to its advanced technology and manufacturing process.
  3. Can I replace DDR memory with HBM in my PC?
    • Not directly. They have different architectures, and using HBM requires specific motherboard and hardware support.
  4. How is HBM2 different from the original HBM?
    • HBM2 offers double the bandwidth per pin and greater capacity than the original HBM.
  5. Are all graphics cards moving to HBM?
    • While many high-end cards are adopting HBM, it’s not universal. Cost and specific performance needs influence the choice.

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